Search results for: '42u rax 600mm x 100 server cabinet'

40G QSFP+ 3:2 (MPO) Transition Assembly.

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MPO MicroCable Fan-Out Assembly.

MPO Fan-Out Assemblies interface multifiber MPO with discrete single fiber (LC/SC) connectors. Assemblies are typically used to directly interconnect MPO  cassettes, panels or backbone trunk assemblies with the active equipment ports, saving costly data center rack space and easing fiber management. Replacing traditional MPO  module Fan-Out Assemblies reduce amount of interconnection improving power budget cost effectiveness.   

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40G QSFP+ (MPO) To QSFP+ Assembly.

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Ultra High Density Splice Module.

Ultra High Density (UHD) System of 2U, 1U and 0U chassis is a platform offering modular splicing solution. UHD modules can feature special internal splice management housing conveniently up to 24 x splice positions. 2U rack space can contain up to 288 splice positions. Both LC (Up to 24 x ports per module) and SC (Up to 12 x ports per module) interfaces are provided. Modular splice system is ideal for Telco infrastructure. Natural demarcation by splice module provides easy selective access to installed/ spliced infrastructure and provides easy way of expending or changing services. Modules can be easily handled and splice work can take place in convenient position away from module destination rack position. Modules can be supplied with factory populated pigtails set or as an empty units.

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Ultra High Density Copper Module.

UHD (Ultra High Density) Copper Module compliments UHD system allowing for copper links to co-exist in common with fiber optics oriented high density management. Copper module if fully compatible with 0U, 1U and 2U UHD chassis system and 2U Patching frame accepting up to 5 modules in 1U and up to 12 x modules in 2U space. Standard module comes with 4 x Category 6A screened tool free RJ-45 keystone jacks for on-site cable termination. Module can be used as a platform to install factory made copper preterm assemblies.   

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